大阳城集团娱乐(666·VIP认证)APP网站-BEST LOBBY

首页  >  封装基板类BT  >  产品详情
HB20-M2

FEATURES

Lead-free compatible Halogen free material

Lower X,Y/Z-axis CTE

High Tg(230℃,DMA)

Keeping high modulus in high temperature

Good punching & Drilling ability 

Excellent Anti-CAF resistance

Excellent in Thickness Uniformity

Excellent in Refractive index and Color consistency


APPLICATIONS

Mini & Micro LED 

Mini & Micro display(HDI)

Mini RGB PKG(1010, F1010.etc.)

IC Package

Memory


GENERAL PROPERTIES

Item

Test method

Unit

HB20-M1

UL No.

-

-

E136069

UL Flammability

UL-94

-

V-0

Min Thickness

UL

mm

0.05

Tg

DMA

230

Td(5%loss)

10℃/min@N_2

390

T260

TMA

min

>60

T288

TMA

min

Thermal Stress

288℃, Solder dip

-

6 cycles pass

Z-axis CTE

Before Tg

PPM/

<25

After Tg

PPM/

150

50-260

%

2.0

X/Y-axis CTE

Before Tg

PPM/

11-13

After Tg

PPM/

5-10

Thermal conductivity

ASTM D5470

W/(m·k)

0.5

Moisture Absorption

D-24/23

%

<0.1

Dielectric Breakdown

D-48/50+D-0.5/23

KV

45KV/mm

Dielectric constant

@1GHz

-

4.2

Dissipation Factor

@1GHz

-

0.007

Peel Strength

A

N/mm

≥0.80N/mm(@H oz)

288℃/10S

≥0.80N/mm(@H oz)

Bending strength (LW/CW)

A

Mpa

480/480

Volume Resistivity

After moisture

MΩ-cm

E-24/125

Surface resistivity

After moisture

MΩ

E-24/125

Young’s modulus

LW

Gpa

28

CW

Gpa


SPECIFICATIONS

Standard Size

1041mm*1244mm

Circuit layer(Electrolytic copper foil)

12μm

18μm

35μm

70μm

105μm


Line up of Core Material

Thickness(mm)

Glass fabrics ply

0.03

1*1037

0.04

1*1067

0.05

1*1078

0.065

2*1037

0.07

2*106

0.10

2*1078

0.15

3*1078

0.20

2*2116

0.30

3*2116

0.40

4*2116

0.50

5*2116

0.60

6*2116

0.80

8*2116

1.00

10*2116

1.20

12*2116

1.50

8*7628

 

Line up of PP material

Thickness(mm)

Glass fabrics

Resin Content

0.035-0.004mm

1027

70%

0.045-0.05mm

1037

71%

0.055-0.06mm

1067

70%

0.065-0.07mm

1067

74%

0.075-0.08mm

1078

65%

0.085-0.09mm

1078

68%

0.12-0.125mm

2116

54%